| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved semiconductor system and method for constituting a conductor for reducing variance of impedance caused by proximity and/or density, and/or operation of connection bump. SOLUTION: The system and the method include a step of adding an impedance reduction conductive element which does not add any function to a semiconductor device. The added element is arranged within a sparse connection bump density area. The impedance reduction conductive element can include a metal wire added between functional metal wires. Arrangement between adjacent operation wires is various. The impedance reduction conductive element can be added to optional one or combination of conductive layers, and the added element can act on the one or combination of functional elements. The added element can be electrically dynamic and can make a response to the operation of the semiconductor device. The added element includes a method which is for deciding connection bump density and which can be automated. COPYRIGHT: (C)2007,JPO&INPIT
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