发明名称 Overlay vernier pattern for measuring multi-layer overlay alignment accuracy and method for measuring the same
摘要 An overlay vernier pattern for measuring multi-layer overlay alignment accuracy and a method for measuring the same is provided. A distance between a first alignment mark in a first material layer and a second alignment mark in an underlying second material layer is measured, so as to provide an alignment offset between the first material layer and the second material layer in addition, a distance between the second alignment mark in the second material layer and a third alignment mark in a third material layer underlying the second material layer is measured, so as to provide an alignment offset between the second material layer and the third material layer. The second alignment marks can be repeatedly used when measuring the alignment accuracy between the first and the second material layers measuring the alignment accuracy between the second and the third material layers.
申请公布号 US7190824(B2) 申请公布日期 2007.03.13
申请号 US20050162028 申请日期 2005.08.25
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHEN TZU-CHING
分类号 G06K9/00;G03F7/20;H01L23/544 主分类号 G06K9/00
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