发明名称 ELECTRONIC ELEMENT AND MANUFACTURING METHOD OF ELECTRONIC ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide an electronic element or the like reduced in breakdown voltage variation and high in reliability while responding to a request of miniaturization/thinning. SOLUTION: Two sheets of plane coils 100 having insulating layers 5 having recesses 5a and conductor patterns 4 formed so as to partially occupy spaces in the recesses are prepared and etching surfaces in respective plane coils 100 are made to face the same direction, and thereafter, vacuum-pressed while pinching an adhesive layer 6. By this operation, the breakdown voltage variation can be suppressed, thus improving a breakdown voltage. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008166407(A) 申请公布日期 2008.07.17
申请号 JP20060352710 申请日期 2006.12.27
申请人 TDK CORP 发明人 KAJINO TAKASHI;ABE TOSHIYUKI
分类号 H01L23/12;H01F17/00;H01F41/04;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/12
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