发明名称
摘要 PURPOSE:To reduce the generation of defects such as a flaw and a pit in a single side grinding method, by which a single side of a board such as a quartz glass board is ground, by using a pressure plate provided with a cushion material in its inside and to provide the single side grinding method by which the number of polishing for eliminating these defects is reduced. CONSTITUTION:In a board single side grinding method, in which a single side of a board 12 held inside a carrier 13 arranged on a surface plate 11 is ground by using a pressure plate 14 inside which a cushion material 15 is arranged, a hydrophilic substance is applied on the surface of the cushion material 15.
申请公布号 JP3073868(B2) 申请公布日期 2000.08.07
申请号 JP19930288083 申请日期 1993.11.17
申请人 发明人
分类号 B24B37/005;B24B37/04;B24B37/30 主分类号 B24B37/005
代理机构 代理人
主权项
地址