| 摘要 |
PROBLEM TO BE SOLVED: To provide a hermetically sealing package capable of bonding and sealing under a low pressure and a low temperature. SOLUTION: In this hermetically sealing package 1 in which the hollow part 20 is hermetically sealed by bonding a lid 10 and a substrate 30, a bonding protrusion 14 is disposed on the backside 13 of the lid 10 facing the top face 34 of the substrate 30, an insertion groove 32 in which the bonding protrusion 14 is inserted is disposed on the top face 34, the bonding protrusion 14 is coated with a bonding film 22a, the insertion groove 32 is coated with a bonding film 22b, and solid phase diffusion bonding is partially applied to the bonding film 22a and the bonding film 22b. COPYRIGHT: (C)2009,JPO&INPIT
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