| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy bed film to make the wiring film of a flat panel display using TFT transistors adhere to a glass substrate, and a sputtering target for forming the film. SOLUTION: This wiring bed film contains more than 6 and not more than 20 mol% of oxygen, and contains 0.2-5 mol% of one or more than two kinds of Mo, Mn, Ca, Zn, Ni, Ti, Al, Mg, and Fe. Its remainder is made of a copper alloy film having composition comprising Cu and inevitable impurities, and the sputtering target is to form the wiring bed film having the same component composition. COPYRIGHT: (C)2009,JPO&INPIT
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