| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating film forming method and a coating system capable of forming a sound coating film by speedily eliminating particles appearing in various kinds of patterns on the surface of the coating film. SOLUTION: A countermeasure for eliminating the sticking of the particles on the surface of the coating film formed on a semiconductor wafer W is previously grasped every states of particle distribution, the coating film is formed on the wafer W, the state of the distribution of the particles stuck to the coating film is detected and the countermeasure corresponding to the detected state of particle distribution is decided based on the previously grasped countermeasure for eliminating the sticking of the particles on the surface of the coating film and the coating film is formed on the next substrate with the condition after the countermeasure. |
