Method and apparatus for forming a layered metal structure with an anodized surface

摘要

Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surface. The first bonding surface can be substantially bonded in direct contact with the stainless steel layer, and the first exterior surface can be an exterior of the housing arrangement. The first exterior surface is an anodized surface. In one embodiment, the first layer can be formed from an anodizable material such as aluminum, titanium, niobium, or tantalum.

主权项

1. A method of anodizing selected portions of a housing of an electronic device, the housing including a multi-layered metal sandwich structure having an anodizable exterior laminate layer bound to a first surface of a non-anodizable layer and an anodizable interior laminate layer bound to a second surface of the non-anodizable layer, the method comprising:
masking a third surface of the non-anodizable layer and a portion of the anodizable exterior laminate layer and interior laminate layer using a mask configured to prevent exposure of the third surface from a subsequent anodizing process; anodizing un-masked portions of the anodizable exterior laminate layer and interior laminate layer by exposing the multi-layered metal sandwich structure to an anodizing process; and removing the mask by cutting away the mask and the third surface of the non-anodizable layer and a portion of the anodizable exterior laminate layer and interior laminate layer.