FORMING A RECESS IN A MULTI-LAYERED DEVICE

摘要

A method related to removing layers in a multi-layered PCB is described. The method includes removing one of more layers of a multi-layered printed circuit board (PCB) layer via material removal techniques. The removal of the layers reduces the thickness of the multi-layered PCB in a section while the thickness in another section of the PCB is maintained. The method includes forming a recess in the section of the multi-layered PCB to provide additional spacing on the multi-layered PCB. The method further includes placing components in the recessed section of the multi-layered PCB.