PACKAGING PROCESS OF ELECTRONIC COMPONENT

摘要

A packaging process of an electronic component includes the following steps. Firstly, a semi-package unit is provided. The semi-package unit includes a first insulation layer and an electronic component. The electronic component is partially embedded within the first insulation layer. The electronic component includes at least one conducting terminal. Then, a metal layer is formed over the surface of the semi-package unit and a part of the metal layer is removed, so that a metal mask is formed on the surface of the semi-package unit and the at least one conducting terminals is exposed. Then, a metal re-distribution layer is formed on the metal mask and the at least one conducting terminal. Then, a part of the metal re-distribution layer and a part of the metal mask are removed, so that at least one contact pad corresponding to the at least one conducting terminal is produced.

主权项

1. A packaging process of an electronic component, the packaging process comprising steps of:
(a) providing a semi-package unit comprising a first insulation layer and an electronic component, wherein the electronic component is partially embedded within the first insulation layer, the electronic component comprises at least one conducting terminal disposed on a surface of the semi-package unit without being covered by the first insulation layer; (b) forming a metal layer over the surface of the semi-package unit and removing a part of the metal layer, so that a metal mask is formed on the surface of the semi-package unit and the at least one conducting terminal uncovered by the metal mask is exposed; (c) forming a metal re-distribution layer on the metal mask and the at least one conducting terminal, so that the metal mask and the at least one conducting terminal is covered by and contacted with the metal re-distribution layer; and (d) removing a part of the metal re-distribution layer and a part of the metal mask, so that at least one contact pad corresponding to the at least one conducting terminal is produced.