发明名称 |
WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION |
摘要 |
A semiconductor wafer is provided including a plurality of dies, each of the plurality of dies including a plurality of semiconductor devices, a plurality of die seals, each of the plurality of die seals being formed at a perimeter of one of the plurality of dies, and a plurality of electrically conductive links, each of the plurality of conductive links connecting one of the plurality of die seals with another one of the plurality of die seals. |
申请公布号 |
US2016240473(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
US201615137740 |
申请日期 |
2016.04.25 |
申请人 |
GLOBALFOUNDRIES Inc. |
发明人 |
Werner Thomas;Aubel Oliver;Feustel Frank |
分类号 |
H01L23/528;H01L25/065;H01L23/532 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor wafer, comprising:
a plurality of dies, each of said plurality of dies comprising a plurality of semiconductor devices; a plurality of die seals, each of said plurality of die seals being formed at a perimeter of one of said plurality of dies; and a plurality of electrically conductive links, each of said plurality of conductive links connecting one of said plurality of die seals with another one of said plurality of die seals. |
地址 |
Grand Cayman KY |