| 发明名称 |
Semiconductor Device Manufacturing Method |
| 摘要 |
A method for producing a semiconductor device includes: a Step A of preparing a chip with sheet-shaped resin composition in which a sheet-shaped resin composition is pasted onto a bump formation surface of a semiconductor chip, a Step B of preparing a substrate for mounting on which an electrode is formed, a Step C of pasting the chip with resin composition to the substrate for mounting so that the resin composition serves as a pasting surface with the bump formed on the semiconductor chip facing toward the electrode formed on the substrate for mounting, a Step D of heating the resin composition to semi-cure the resin composition after the Step C, and a Step E of heating the resin composition at a higher temperature than that in the Step D to cure the resin composition after the Step D while bonding the bump and the electrode. |
| 申请公布号 |
US2016240394(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201415024579 |
申请日期 |
2014.09.19 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
Fukui Akihiro;Takamoto Naohide;Hanazono Hiroyuki |
| 分类号 |
H01L21/56;H01L21/48 |
主分类号 |
H01L21/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for producing a semiconductor device, comprising:
a Step A of preparing a chip with sheet-shaped resin composition in which a sheet-shaped resin composition is pasted to a bump formation surface of a semiconductor chip, a Step B of preparing a substrate for mounting on which an electrode is formed, a Step C of pasting the chip with sheet-shaped resin composition to the substrate for mounting so that the sheet-shaped resin composition serves as a pasting surface with the bump formed on the semiconductor chip facing toward the electrode formed on the substrate for mounting, a Step D of heating the sheet-shaped resin composition to semi-cure the sheet-shaped resin composition after the Step C, and a Step E of heating the sheet-shaped resin composition at a higher temperature than that in the Step D to cure the sheet-shaped resin composition after the Step D while bonding the bump and the electrode. |
| 地址 |
Ibaraki-shi, Osaka JP |
