发明名称 |
Method of forming metal gate electrode |
摘要 |
An aspect of this description relates to a method that includes partially filling an opening in a dielectric material with a high-dielectric-constant material. The method also includes partially filling the opening with a first metal material over the high-dielectric-constant material. The method further includes filling the opening with a capping layer over the first metal material. The method additionally includes partially removing the first metal material and the capping layer in the opening using a wet etching process in a solution including one or more of H2O2, NH4OH, HCl, H2SO4 or diluted HF. The method also includes fully removing the remaining capping layer in the opening using a wet etching process in a solution includes one or more of NH4OH or diluted HF. The method further includes depositing a second metal material in the opening over the remaining first metal material. |
申请公布号 |
US9449828(B2) |
申请公布日期 |
2016.09.20 |
申请号 |
US201514936939 |
申请日期 |
2015.11.10 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Hou Cheng-Hao;Lim Peng-Soon;Lee Da-Yuan;Yu Xiong-Fei;Chou Chun-Yuan;Hsu Fan-Yi;Chen Jian-Hao;Hsu Kuang-Yuan |
分类号 |
H01L21/28;H01L29/49;H01L29/66;H01L29/40;H01L29/78;H01L29/51 |
主分类号 |
H01L21/28 |
代理机构 |
Hauptman Ham, LLP |
代理人 |
Hauptman Ham, LLP |
主权项 |
1. A method, comprising:
partially filling an opening in a dielectric material with a high-dielectric-constant material; partially filling the opening with a first metal material over the high-dielectric-constant material; filling a remaining portion of the opening with a capping layer over the first metal material; partially removing the first metal material and the capping layer in the opening using a first wet etching process; fully removing the remaining capping layer in the opening using a second wet etching process; and depositing a second metal material in the opening over the remaining first metal material. |
地址 |
TW |