发明名称 Method of forming metal gate electrode
摘要 An aspect of this description relates to a method that includes partially filling an opening in a dielectric material with a high-dielectric-constant material. The method also includes partially filling the opening with a first metal material over the high-dielectric-constant material. The method further includes filling the opening with a capping layer over the first metal material. The method additionally includes partially removing the first metal material and the capping layer in the opening using a wet etching process in a solution including one or more of H2O2, NH4OH, HCl, H2SO4 or diluted HF. The method also includes fully removing the remaining capping layer in the opening using a wet etching process in a solution includes one or more of NH4OH or diluted HF. The method further includes depositing a second metal material in the opening over the remaining first metal material.
申请公布号 US9449828(B2) 申请公布日期 2016.09.20
申请号 US201514936939 申请日期 2015.11.10
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Hou Cheng-Hao;Lim Peng-Soon;Lee Da-Yuan;Yu Xiong-Fei;Chou Chun-Yuan;Hsu Fan-Yi;Chen Jian-Hao;Hsu Kuang-Yuan
分类号 H01L21/28;H01L29/49;H01L29/66;H01L29/40;H01L29/78;H01L29/51 主分类号 H01L21/28
代理机构 Hauptman Ham, LLP 代理人 Hauptman Ham, LLP
主权项 1. A method, comprising: partially filling an opening in a dielectric material with a high-dielectric-constant material; partially filling the opening with a first metal material over the high-dielectric-constant material; filling a remaining portion of the opening with a capping layer over the first metal material; partially removing the first metal material and the capping layer in the opening using a first wet etching process; fully removing the remaining capping layer in the opening using a second wet etching process; and depositing a second metal material in the opening over the remaining first metal material.
地址 TW