发明名称 |
ELECTRONIC CIRCUIT BOARD AND SOLDERING METHOD THEREFOR |
摘要 |
This invention discloses an electronic circuit board which can eliminate a soldering error for a component arranged such that its terminal array is perpendicular to the convey direction of the electronic circuit board which is to be flow-soldered, and a soldering method for it. An extending land (6) is formed to be substantially perpendicular to a convey direction (D) for flow soldering and to extend toward a downstream side of the warp of a board (2).
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申请公布号 |
CA2300020(A1) |
申请公布日期 |
2000.08.26 |
申请号 |
CA20002300020 |
申请日期 |
2000.02.25 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
SOMEYA, KEISUKE;OKABE, AKIRA |
分类号 |
B23K1/00;B23K1/08;H05K1/11;H05K3/34;(IPC1-7):H05K1/02 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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