| 摘要 |
PURPOSE:To prevent the imperfect connection and the damage to an IC chip caused by the warpage of tool by forming a bump shape so as to conform to the warp of a heater tool in the manner in which the bump diameter of a protruding part of the heater tool is made small and the diameter of a recessed part of the tool is made large. CONSTITUTION:Bumps 4 having different diameters according to bonding parts at the time of inner lead bonding are formed on an aluminum electrode pad 2 on a semiconductor chip 1. That is, in order to conform to the warp of a heater tool 9 at the time of inner lead bonding, a bump 4 of small diameter is formed on a protruding part (end-portion) of the tool 9, and bump 4 of larger diameter is formed on the inverse part (central part). Thereby, when a film carrier is mounted on a large chip, the imperfect connection and the damage on an IC chip caused by the warp of a tool can be prevented. |
