| 摘要 |
PURPOSE:To enable a multilayer printed board to be free of interlaminar bubbles and interlaminar deviation by a method wherein pressure measuring elements are disposed on the face of jig plate in contact with a laminated body to measure the distribution of pressure of the molten insulating adhesive agent so as to determine an bonding condition. CONSTITUTION:A printed wiring board 1A whose pressure distribution is to be measured and an insulating adhesive agent 1B are alternately laminated to form a laminated body 1, and the laminated body 1 is pinched between a measuring jig plate 4 composed of an upper jig plate 2 and a lower jig plate 3. Pressure measuring elements 5 used for measuring the pressure of the molten insulating adhesive agent 1B are disposed in lattice on the lower jig plate 3. When the measuring jig plate 4 is inserted into a hot press 6 and hot-pressed, the adhesive agent 1B is fused to start flowing out to a peripheral part. At this point, the output signals of the pressure measuring elements 5 are taken out, and the signals amplified by an amplifier 7 are recorded in a recorder 8 to record the change of the adhesive agent in pressure distribution. Basing on the measured result, a proper bonding condition can be easily determined. |
