| 摘要 |
<p>PURPOSE:To eliminate the necessity of protective film removing liquid and to remove a resin film within a short time, by exfoliating the resin film for protecting a substrate with an adhesive tape when the substrate is divided. CONSTITUTION:A plurality of dividing grooves 17 penetrating a resin film 16 are formed on a wafer 5, along the lattice type boundary lines for dividing the wafer 5 into chips. An adhesive tape 18 is bonded on the resin film 16. On said tape, adhesive agent is spread whose adhesion is about 150-200g/cm<2> as compared with the resin film 16 of excel coat whose adhesion is about, e.g. 10-20g/cm<2> to the wafer 5. When the adhesive tape 18 is peeled, the resin film 16 is exfoliated from the wafer 5 together with the adhesive tape 18. Next the wafer 5 is cut off along the groove 17.</p> |
