| 摘要 |
PROBLEM TO BE SOLVED: To enable a pop corn phenomenon to occur less in a thermal treatment process by a method, wherein a pressure built up in a cavity by packing with a lid is adjusted to a prescribed value. SOLUTION: A large number of solder balls 9 are arranged at a regular interval, on the surface of a semiconductor board 2 opposite to its other surface where a semiconductor chip 4 is bonded, and a pressure built up in a cavity 1 is adjusted to a prescribed value. Therefore, in a hermetically sealed pressure- controlled chamber 10 whose inner pressure is controlled as prescribed, a heat dissipating adhesive agent 5 is applied around the center and all peripheral sides of the surface of a lid 8, and the lid 8 is bonded to the semiconductor board 2, making its adhesive agent applied surface face toward the semiconductor chip 4 so as to hermetically seal up the semiconductor chip 4. Thereafter, the solder balls 9 arranged on a positioning jig 11 are mounted on the wiring board 2 while being sucked by vacuum, and when a semiconductor device is dry-packaged, a packaging operation is carried out in the pressure-controlled chamber 10, whose inner pressure is adjusted to 1.1 to 1.5 times as high as one pressure. |
