Datentransferkopf

摘要

A data transfer head 22 comprises a combination assembly formed from an integrated suspension 26, slider 24 and transducer 25. The combination transducer-slider-suspension assembly is batch produced by forming a plurality of the combination assemblies onto a single wafer 100. The wafer is then diced to separate the assemblies into individual sections 106, 108. The transducers are deposited onto the wafer and the air bearing surface formed. Conductors 42 to interconnect each transducer with the external circuits are insulated from the wafer and deposited along a path which will form the suspension. A spring-like resilient layer is then deposited over and electrically insulated from the conductors. The wafer is then pattern etched to remove a portion of the wafer backside to form the suspension. Integrated circuit amplifiers 56 can be deposited at the free end of the conductors prior to separation of individual assemblies.