STACKABLE BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

摘要

PURPOSE: A semiconductor chip package and its manufacturing method are to increase reliability and mounting density of the package without deformation of an outer lead. CONSTITUTION: A supporting element(21) containing a semiconductor chip therein comprises a supporting plate(23) at its bottom and a supporting frame(25) of predetermined height along an edge of the supporting plate. A metal conductive path(24a) is formed at a bottom of the supporting plate. A surface of the supporting plate and the metal conductive path are covered with a solder resist(27) which protects short between a conductive ball of a BGA package and the metal conductive path. It also protects the metal conductive path from external shock. The solder resist is partly removed to expose the metal conductive path partly. Such exposed part of the metal conductive path is called as a connecting part(24b). A metal pattern(26) as a conductive path is embedded inside of the supporting frame. One end of the metal pattern is connected to one end of the metal conductive path while the other end is exposed on the top of the supporting frame.