| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and apparatus for transmitting power to a semiconductor die. SOLUTION: A method and apparatus are provided for transmitting power to a semiconductor die having a metal frame 104 mounted on its upper surface. The metal frame has two voltage leads 106 and 108, which are provided adjacent to a series of bonded pads 116 formed on the upper surface of the semiconductor die. Each of the voltage leads has a vertical part 122 adjacent to the bond pads 116 at the center of the semiconductor die and an arm part 125 adjacent to the bond pads 116 which are positioned in a corner part 124 or in a quadrant of the semiconductor die. |
