| 摘要 |
PROBLEM TO BE SOLVED: To shorten process time and to considerably reduce the amount of used conductive adhesive, by forming conductive adhesive on the surface of a plate, and forming the conductive adhesive of prescribed thickness on bumps formed on a device. SOLUTION: The layer 103 of conductive adhesive is formed on a plate 101 whose surface is plane in a pattern form corresponding to bumps by using the trace supply device 102 of conductive adhesive. A semiconductor chip 201 with bumps 202 is pushed into the layer 103 of conductive adhesive. Then, the semiconductor chip 201 is pulled up and the bumps 202 are detached from the layer of conductive adhesive. The bumps 202 to which prescribed amount of conductive adhesive 107 is adhered are formed and they are used for loading the semiconductor chip 201 on a circuit board. Then, conductive adhesive left on the plate 101 is scratched away. Then, conductive adhesive using solvent whose boiling point is low can be used and therefore process time can be shortened. |
