| 摘要 |
PROBLEM TO BE SOLVED: To make the thickness small which is required for attaching a CCD package, to highly accurately attach the CCD package to an optical unit, and also to improve the operability of attachment. SOLUTION: First, a CCD package 10 is surface mounted on a flexible substrate 30. Then, the upper surface of the CCD package 10 parallel to the image formation surface of a solid-state image-pickup device chip 12 is used as reference surfaces 20 and 22, the reference surfaces 20 and 22 are abutted on the reference surface 41 of the optical unit 40, and the CCD package 10 is pressurized by a leaf spring 50 and fixed to the optical unit 40. Thus, positioning inside the plane of the image formation surface of the solid-state image-pickup chip 12 (that is, the positioning of the center of the effective image-pickup surface of the solid-state image-pickup chip 12 and the optical axis of the optical unit 40) is performed, and the positioning of the rotation of the effective image- pickup plane is made. |
