| 摘要 |
<p>A support cylinder (10) for guiding freshly processed substrate material (S) between printing units (20A, 20B, 20C, 20D) or at the delivery end of a printing press is provided with a low coefficient of friction, semi-conductive base covering (56, 60, 70, 80, 90, 100, 106) for supporting and guiding the freshly processed substrate material without smearing the ink or causing indentations on the surface of the substrate. Radially projecting surface portions (56A, 56B, 74, 84, 94) of the semi-conductive base covering define electrostatic precipitation points and reduce the surface area available for frictional engagement. The low friction and semi-conductive properties of the cylinder base covering permit free movement of the freshly processed substrates (S) relative to the support cylinder (34). Electrostatic charges carried by the freshly processed substrates are discharged through the semi-conductive base covering into the support cylinder 34, thus eliminating electrostatic cling attraction between the freshly processed substrate and the base covering. <IMAGE></p> |
