| 摘要 |
PROBLEM TO BE SOLVED: To convey and heat a sheet substrate, while protecting the face to which a photosensitive resin layer is press-bonded and the photosensitive resin layer from scuffing and the sticking of dust and to press-bond the photosensitive resin layer without reducing the temperature of the heated substrate. SOLUTION: An air flow panel 18 and a heating plate 24 have air exhaling holes 20, 26, respectively. A sheet substrate K is conveyed and heated with the face to which a photosensitive resin layer is press-bonded downward while keeping a non contact state with air spouted from the air spouting holes 20, 26. Inversion of the heated substrate K is not necessary, the lower face of the substrate K is protected from scuffing and the sticking of dust, and the photosensitive resin layer is press-bonded without reducing the temperature of the heated substrate K. |
