| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip mounting method for making the quantity of flux transferred in plural solder bumps to be uniform, stabilizing the wettability of solder on an electrode for bump connection at reflow and surely mounting a semiconductor substrate on a substrate. SOLUTION: Recessed parts 14 are formed in the tip parts of plural solder bumps 3, and a prescribed quantity of flux 4 is individually supplied to the recessed parts 14. Thus, the quantity of flux 4 supplied can individually be controlled/managed for the respective solder bumps 3. Then, flux 4 can be held in the recessed parts 14 of the solder bumps 3, after it is transferred to the solder bumps 3. Consequently, the quantity of flux 4 transferred to the solder bumps 3 can be made uniform. Thus, wettability of solder to an electrode for bump connection 5 at reflow can be stabilized, and a semiconductor device 1 can be mounted surely on a substrate. |
