BONDING METHOD, BONDING DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE METHOD AND DEVICE

摘要

PROBLEM TO BE SOLVED: To improve bonding performance of a bonding device and improve quality of the product of the bonding device. SOLUTION: A bonding device comprise a bonding heat with a capillary for bonding, a spring member which supports the bonding head and a spring force correcting circuit which corrects the elastic force of the spring member according to the position of the bonding head in the vertical direction. Bonding of the pads and inner leads of a semiconductor chip is conducted after the elastic force of the spring member is corrected by the spring force correction circuit, to reduce variation in the operation controllability of the transfer of the bonding head.