| 摘要 |
PROBLEM TO BE SOLVED: To easily know the cutting places by forming projecting sections between element regions and, after sealing the surface of a wafer with the resin so that the ends of the projecting sections and of bump electrodes on the element regions may be exposed, removing the projecting sections and then dividing the wafer along the element regions. SOLUTION: On scribe lines 3, identification marks 20 which can be discriminated from bump electrodes 14 on element regions 1 are formed. Next, the entire surface of a wafer 2 formed with the bump electrodes 14 and the identification marks 20 is covered with the resin 21. Then, by polishing the surface of the resin 21, the ends of the bump electrodes 14 and of the identification marks 20 are exposed on the surface of the resin 21. Along the scribe lines 3, the wafer 2 is cut. Although the scribe lines 3 are covered with the resin 21 and cannot be directly seen, the identification marks 20 exposed on the resin 21 makes it possible to estimate the locations of the scribe lines 3. |
