发明名称 MATERIAL SELECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a material selection method capable of exactly selecting the component materials, etc., of a coating application development processing device to be exposed to an atmosphere at the time of use. SOLUTION: A container 102 of a capturing device 100 is set at 23 deg.C which is the same as the temperature within the coating application development processing device. A candidate material for the component materials, etc., of the coating application development processing device as a specimen S is placed on a holder 108 in the container 102. N2 of 23 deg.C which is the same as the temperature within the coating application development processing device and 45% in humidity is supplied in a laminar flow state into the container 102 to expose the specimen S to N2. The gaseous components released from the specimen S are introduced together with N2 to an impinger 134 and is captured by extra- pure water W4. The qualitative and quantitative analyses of the gaseous components included in the capturing liquid W4 are executed by an ion chromatographic apparatus, etc. The upper limit use amount and initial contamination removal period of the material within the coating application development processing device to be the data for selecting the material are determined from the analysis results.
申请公布号 JP2000258918(A) 申请公布日期 2000.09.22
申请号 JP19990060355 申请日期 1999.03.08
申请人 TOKYO ELECTRON LTD 发明人 RA SO;KITANO JUNICHI;KATANO TAKAYUKI
分类号 H01L21/027;G03F7/30 主分类号 H01L21/027
代理机构 代理人
主权项
地址