WIRING BOARD AND CONNECTION STRUCTURE THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a wiring board provided with high connection strength and stability with high connection reliability by an Au ribbon with another external electric circuit even after mounting a semiconductor element by brazing metal filler of Au-Sn or the like and the connection structure. SOLUTION: On this wiring board A composed by attaching and forming a wiring circuit layer 2 whose main component is Cu on at least the surface of an insulation substrate 1 composed of a glass ceramic sinter, a connection pad 7 for connecting the other electric circuit by the Au ribbon 8 is provided on the end part of the wiring board A. The connection pad 7 is composed by successively forming an Ni plated film 7b with the thickness of 1-6 μm and an Au plated film 7c with the thickness of 1.5 μm or more on the surface of a conductor layer 7a whose main component is Cu. The width x of the connection pad 7 connected with the Au ribbon 8 is made larger than the width y of the connected Au ribbon 8 for 20 μm or more.