| 摘要 |
PROBLEM TO BE SOLVED: To prevent re-attachment of a cathode material in consideration of etching process, in which the cathode for mounting an etching object is also etched and the cathode material is re-deposited on the etching object, when the etching object is etched by a plasma apparatus. SOLUTION: In a vacuum chamber 15, included in the plasma etching apparatus, each projected stripe with a right-angle triangular cross section and each grove 57 are alternately formed on the surface of the cathode electrode 20 provided facing opposite to an anode electrode 37. |
