THROUGH HOLE WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a through hole wiring board where the conductive connection/formation of through holes are easy, connection reliability is high and is constituted of a thin conductive material formed on a copper foil land. SOLUTION: The through hole 10 formed through a base material 3 is filled with the conductive material. The copper foil land 7 and copper foil circuits 8 and 11 are formed on the surface of the base material 3. An insulating layer 5 is formed on the copper foil circuit 11 and between the copper coil land 7 and the copper foil circuit 11. A printing circuit (jumper circuit 6) is formed in a part of the copper foil circuit 8, on the copper foil land 7 and the insulating layer 5 where a part which does not require conduction is removed by the conductive material whose composition is different from the conductive material packed in the through hole 10. The printing circuit and the end part of the through hole 10 are conduction/connected by the conductive materials of same quality.