| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize optical communication equipment or the like in which a butterfly type semiconductor module having a light emitting element is used. SOLUTION: In this structure, an electrode pin 13 of the butterfly type semiconductor module having a light emitting element is made an L-shaped structure, and the electrode pin 13 is fixed to a substrate 15. As a result, the length of a notch of the substrate can be made the length of the butterfly type semiconductor module, so that the substrate 15 can be contracted and equipment using a laser diode module can be miniaturized.
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