发明名称 PACKAGING STRUCTURE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To greatly reduce ESL for inhibiting vibrations in a supply voltage. SOLUTION: A multiple-port layered capacitor 10 and an LSI 104 are connected to a power supply 102, in parallel by wirings 106 and 108. More specifically, terminal electrodes 31 and 35 arranged on a side 12B are connected to the electrode section of the positive side of the power supply 102 and one side of the LSI 104 by the wiring 106. Terminal electrodes 33 and 37, that are arranged in the same side surface while being adjacent to the terminal electrodes 31 and 35 are connected to the electrode section of the negative side of the power supply 102 and the other of the LSI 104 by the wiring 108.
申请公布号 JP2002164245(A) 申请公布日期 2002.06.07
申请号 JP20000357058 申请日期 2000.11.24
申请人 TDK CORP 发明人 TOGASHI MASAAKI;ABIKO TAISUKE;ISHIGAKI TAKAYA
分类号 H01G2/06;H01G4/30;H01G4/38;(IPC1-7):H01G2/06 主分类号 H01G2/06
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