发明名称 |
THERMAL INSULATING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermal insulating material capable of ensuring strength as well as the excellence in heat insulation property, obtaining the excellent heat insulation property at low cost and controlling the heat insulation property. SOLUTION: A plurality of heat insulating molding bodies 12 and a plurality of heat conductive surface radiation shielding bodies 11 are alternately laminated, a plurality of through-holes 13 are formed in the heat conductive surface radiation shielding bodies 11 and, at the same time, the through-holes filled with binders to connect the adjoining heat insulating molding bodies 12 to each other through the heat conductive surface radiation shielding bodies 11.
|
申请公布号 |
JP2002201729(A) |
申请公布日期 |
2002.07.19 |
申请号 |
JP20000399668 |
申请日期 |
2000.12.28 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUZUKI MASANORI;MORITA MASATAKA;TSUTSUI YUJI |
分类号 |
E04B1/80;B32B5/00;B32B7/14;E04C2/34;(IPC1-7):E04B1/80 |
主分类号 |
E04B1/80 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|