发明名称 |
Heat conductive silicone composition and shaped article |
摘要 |
A heat conductive silicone composition comprising (a) an organopolysiloxane having alkenyl groups only at both ends of a molecular chain, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having Si-H groups only at both ends of a molecular chain, and (d) a platinum group curing catalyst is shaped into an article which conforms to a member and permits heat to dissipate from the member without applying stresses thereto.
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申请公布号 |
US7034073(B2) |
申请公布日期 |
2006.04.25 |
申请号 |
US20030720131 |
申请日期 |
2003.11.25 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
ASAINE MASAYA |
分类号 |
C08J5/18;C08L83/05;C08G77/04;C08K3/00;C08K3/04;C08K3/08;C08K3/20;C08K3/28;C08K3/34;C08L83/04;C08L83/07 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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