Production of an thin object by molding, comprises injecting a thermoplastic material through a slit in a cavity

摘要

The slit extending in a direction, which is parallel to a plane of the object surface. The process further comprises: inserting a coil in a conducting material and an integrated circuit; and ejecting the cavity in a perpendicular direction to the plane of the surface. Independent claims are included for: (1) a mold to carry out the above process; and (2) a chip card.