| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component mounted wiring board capable of solving the problem of tensile stress due to thermal expansion, and freely forming a pattern circuit on the board without enlarging a board size. SOLUTION: The chip component mounted wiring board has a pair of lands 16 and 17 for soldering terminals 11 and 12 of a chip component 10 of an electronic device provided on one of surfaces 15A, while a groove 19 is formed on the surface 15A between the pair of lands 16 and 17. COPYRIGHT: (C)2007,JPO&INPIT
|
