摘要 |
<p>A metal composite laminate for manufacturing a flexible wiring board is characterized in that a wiring forming metal layer for forming a wiring pattern is laminated on the front surface of a flexible insulating resin layer, a support metal layer serving as a support is laminated on the back surface of the insulating resin layer, the total thickness (W<SUB>t</SUB>) of the metal composite laminate is 35 to 130 µm, the thickness (W<SUB>0</SUB>) of the insulating resin layer is 10 to 30µm, the average surface roughness (Rz-1) of the wiring forming metal layer facing to the front surface of the insulating resin layer is 0.5 to 6.0 µm, the average surface roughness (Rz-2) of the support metal layer facing to the back surface of the insulating resin layer is 0.5 to 3.0 µm, the total [(Rz-1)+(Rz-2)] of the average surface roughness (Rz-1)of the wiring forming metal layer and the average surface roughness (Rz-2) of the support metal layer is 3 to 60% of the thickness (W<SUB>0</SUB>) of the insulating resin layer, and the ratio [(Rz-2):(Rz-1)]of the average surface roughness (Rz-2) of the support metal layer to the average surface roughness (Rz-1) of the wiring forming metal layer is 4:1 to 1:12. The wiring board of the invention can be manufactured from the above laminate. According to the invention, a wiring board having flexibility and usable even if it is bent can be manufactured.</p> |
申请人 |
MITSUI MINING & SMELTING CO., LTD.;SATO, TETSURO;YAMAGATA, MAKOTO;IWATA, NORIAKI;ONO, TOSHIAKI;KOMODA, YASUO;KATAOKA, TATSUO;CHIKUJO, SHUJI;OGAWA, NAOAKI |
发明人 |
SATO, TETSURO;YAMAGATA, MAKOTO;IWATA, NORIAKI;ONO, TOSHIAKI;KOMODA, YASUO;KATAOKA, TATSUO;CHIKUJO, SHUJI;OGAWA, NAOAKI |