发明名称 |
OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
A low-capacitance package having a wide hole, an L-shaped lead pin, other linear lead pins, an insulating material filling in the hole for fixing the L-shaped lead pin and another pin in the hole. Projecting from the hole, the horizontal part of the L-shaped pin is separated from the insulating material and stands higher than the surface of the package. A semiconductor device chip is fixed directly on the horizontal part of the L-shaped pin. <IMAGE> |
申请公布号 |
KR100265456(B1) |
申请公布日期 |
2000.10.02 |
申请号 |
KR19970036435 |
申请日期 |
1997.07.31 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
FUJIMURA, YASUSHI;KUHARA, YOSHIKI |
分类号 |
H01L31/10;G02B6/42;H01L23/02;H01L31/0203;H01L31/0232 |
主分类号 |
H01L31/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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