| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die bonding paste having improved adhesiveness in a hot state, which can not be conventionally achieved, having little change with time in a high temperature state, having excellent heat resistance and durability and giving a cured product with less warpage. <P>SOLUTION: The die bonding paste comprises (A) an allyl-modified epoxy resin expressed by general formula (1), (B) a bismaleimide group-containing polyimide resin having a number average molecular weight of 200 to 10,000, (C) an organic peroxide, (D) an amine-based curing agent, (E) an inorganic filler and (F) an imidazole-based curing accelerator. In the formula, for example, n is 0, one of R<SP>1</SP>to R<SP>8</SP>is an allyl group and others are hydrogen atoms, and X is C(CH<SB>3</SB>)<SB>2</SB>. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
