| 摘要 |
A semiconductor device, a mounting structure, an electro-optical apparatus, an electronic system, and a method for manufacturing an electronic component are provided to improve the stabilization of contact resistance by preventing a crack on a conductive layer due to deformation of a bump. A protrusion electrode(P) has a bump(13) made of resin, a base layer(14a) formed on the bump, and a surface conductive layer(14b) formed on the base layer. The base layer is comprised of material having ductility lower than the surface conductive layer. The base layer is arranged on the vertex of the protrusion electrode. The base layer is made of material whose adhesion for the bump is greater than the surface conductive layer. A base electrode(11) is formed on a region except for the region on which the bump is formed. The surface conductive layer is conductively connected to the base electrode. The base layer is made of a conductive material. The surface conductive layer is conductively connected to the base electrode through the base layer. |
