| 摘要 |
A formation method of a low reflectance dielectric thin film with superior resistance against heat, munidity, and chemical, and superior durability is provided to form an intermediate layer serving as buffer so as to minimize the problem resulting from external stress. A formation method of a low reflectance dielectric thin film with superior resistance against heat, munidity, and chemical, and superior durability comprises a step of forming a dielectric layer having middle refractive index and middle density or a dielectric layer having middle refractive index and high density between low refractivity and low density dielectric layers(3a,3b,5a,5b,9a,9b) and high refractivity and high density dielectric layers(7a,7b). The dielectric layer forming step includes stabilizing the laminating structure by performing heat-treatment at the temperature of 30~130°C below the deformation temperature of plastic optical lens in three days after completion of dielectric deposition. The low refractivity and low density dielectric is formed of more than one kind selected from the group consisting of SiO2, MgF2, LiF, NaF, CeF3 and CeF2. The high refractivity and high density dielectric is formed of more than one kind selected from the group consisting of ZrO2, TiO2, ITO, ZnS and La2O3. |
