| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity when turning by a tool and CMP or dry-polishing are performed on a wafer.SOLUTION: Machining means 30 provided on a surface machining device 1 is equipped with tool turning means 40 circulating a tool 44 about a rotation shaft 49 extending in a vertical direction to a holding surface 21 of holding means 20 holding a wafer W; polishing means 50 for rotating a polishing pad 53 about the rotation shaft 49 in the inside of a circulation path of the circulating tool 44; and advancing/retracting means 60 for relatively moving the tool 44 and the polishing pad 53 in directions coming close to or separating from the holding surface 21. Either one of the tool 44 or the polishing pad 53 can be selectively acted on a surface W1 of the wafer W to be machined, and turning machine by the tool 44 and polishing machine by the polishing pad 53 are enabled by one device. Therefore, it is not necessary to carry the wafer W between devices, and productivity is improved.SELECTED DRAWING: Figure 1 |
