Epoxy resin blend dispersion and a process for preparing the dispersion

摘要

The present invention relates to an aqueous epoxy resin blend dispersion of a high mw epoxy resin and a liquid epoxy resin with a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the epoxy resin blend against water is less than 2 dynes/cm, preferably less than 1 dyne/cm, and a process for preparing this epoxy resin blend dispersion. Specifically, the process is a solvent free melt kneading or shearing dispersion process wherein the dispersion is processed at from 50 to 150° C., and the resulting dispersion is stable.

主权项

1. An aqueous epoxy resin dispersion comprising, based on the total solids weight in the epoxy resin dispersion,
i) from 20 wt. % to 60 wt. %, a high molecular weight (Mw) epoxy resin; ii) from 30 wt. % to 70 wt. %, a liquid epoxy resin; and iii) from 2 wt. % to 20 wt. %, a dispersant having an interfacial tension such that a drop of the mixture of the dispersant in a melt of the high Mw and liquid epoxy resin blend against water is less than 2 dynes/cm, wherein the epoxy resin dispersion is a homogeneous dispersion; the high Mw epoxy resin has an epoxide equivalent weight of from 800 to 10000 g/eq, and a weight average molecular weight of from 3000 to 40000; and the liquid epoxy resin has an epoxide equivalent weight of from 100 to 200 g/eq, and a weight average molecular weight of from 200 to 600.