发明名称 ETCHING PROCESSING METHOD AND BEVEL ETCHING APPARATUS
摘要 In an etching process of a bevel part, abnormality in an output value of a laser beam is detected. Disclosed is an etching processing method using a bevel etching apparatus for etching a substrate by irradiating a laser beam, the bevel etching apparatus including a laser generator and an image capturing unit. The method includes the steps of: by the image capturing unit, capturing an image of an inner part of a processing container by illuminating the inner part of the processing container by scattered light of the laser beam emitted from the laser generator; calculating the brightness of an image of a predetermined area out of the captured image of the inner part of the processing container; and monitoring, based on data indicating a correlation between an output value of the laser beam output from the laser generator and the brightness, the output value of the laser beam with respect to the calculated brightness.
申请公布号 KR20160072044(A) 申请公布日期 2016.06.22
申请号 KR20150175608 申请日期 2015.12.10
申请人 TOKYO ELECTRON LIMITED 发明人 KONDO MASAKI
分类号 H01L21/311;H01L21/268;H01L21/3065;H01L21/3213;H01L21/66 主分类号 H01L21/311
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