CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

摘要

A configurable central processing unit (CPU) package substrate is disclosed. The package substrate including a processing device interface is described. The package substrate also includes a memory device electrical interface arranged on the package substrate. The package substrate also includes a removable memory mechanical interface arranged proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.