发明名称 Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and display device
摘要 Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.
申请公布号 US9405188(B2) 申请公布日期 2016.08.02
申请号 US201414445567 申请日期 2014.07.29
申请人 Samsung SDI Co., Ltd. 发明人 Lee Jong-Hwa;Kwon Ji-Yun;Kim Sang-Soo;Noh Kun-Bae;Park Eun-Bi;Baek Jae-Yeol;Lee Bum-Jin;Lee Sang-Haeng;Hwang Eun-Ha
分类号 G03F7/023;C08G73/10;C08G73/22;G03F7/022;G03F7/075 主分类号 G03F7/023
代理机构 Additon, Higgins & Pendleton, P.A. 代理人 Additon, Higgins & Pendleton, P.A.
主权项 1. A positive photosensitive resin composition, comprising: (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 5:20 to about 20:5, and wherein the thermal acid generator comprises one or more compounds represented by the following Chemical Formulae 45 to 48:
地址 Yongin-si KR