发明名称 GAN-BASED SCHOTTKY DIODE HAVING LARGE BOND PADS AND REDUCED CONTACT RESISTANCE
摘要 A semiconductor device includes a first active layer disposed over a substrate. The second active layer is disposed on the first active layer. The second active layer has a higher bandgap than the first active layer such that a two-dimensional electron gas layer arises between the first active layer and the second active layer. The first electrode establishes a Schottky junction with the second active layer. The first electrode includes a first electrode pad and a first series of fingers in electrical contact with the first electrode pad. The second electrode establishes an ohmic junction with the first active layer. The second electrode includes a second electrode pad and a second series of fingers in electrical contact with the second electrode pad. The first and second series of electrode fingers form an interdigitated pattern. The first electrode pad is located over the first and second series of electrode fingers.
申请公布号 WO2016133527(A1) 申请公布日期 2016.08.25
申请号 WO2015US16752 申请日期 2015.02.20
申请人 VISHAY GENERAL SEMICONDUCTOR LLC 发明人 LIN, Yih-yin
分类号 H01L29/872 主分类号 H01L29/872
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