发明名称 SUBSTRATE GRIPPING DEVICE AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate gripping device capable of precisely adjusting the unevenesss or flatness of the substrate holding surface of a gripping plate for gripping a substrate. SOLUTION: A substrate gripping device is provided with a gripping plate 18 for gripping a substrate in a front face, and a plate 20 to be covered attached to form a spacing S with the gripping plate 18 in the backside of the gripping plate 18. The plates 20 to be covered are connected to each other by a plurality of bolt arrays 44 and 46 disposed in a peripheral direction at a specified interval, and the bolt arrays 44 and 46 are disposed in two rows at least in a coaxial relation.
申请公布号 JP2000288924(A) 申请公布日期 2000.10.17
申请号 JP19990102613 申请日期 1999.04.09
申请人 EBARA CORP 发明人 OWADA SHIN
分类号 B24B37/04;B24B37/30;H01L21/304;H01L21/68;H01L21/683 主分类号 B24B37/04
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